M-SOLV Dual-Laser Microfabrication System
IR + DUV in one platform for micron-scale fabrication · Process optimisation · Vision-guided alignment
Design → Toolpaths → Laser Fabrication → Lamination → Assembly → Metrology → Test → Iterate
What this enables
Micron-scale features with clean edges and controlled taper
Fast iteration via parameter sweeps and recipe tiling (optimize in hours, not weeks)
Tight alignment across multi-step builds (registration + calibrated scanners)
Production-ready repeatability with documented process parameters & logs
Hardware highlights
Lasers: IR 1064 nm (up to 20 W, 3–500 ns, to 1 MHz), DUV 266 nm (up to 4 W, ns-class pulses, to 100 kHz)
Motion platform: 500 × 300 mm XY travel; accuracy ±5 µm; repeatability ±0.5 µm; 100 nm resolution. Z travel 100 mm; repeatability ±1 µm; 0.5 µm resolution
Optics: adjustable beam expanders, CNC aperture (top-hat/DOE), dual galvo scanners with f-theta lenses; DUV line includes high-NA focusing path for near-vertical sidewalls
Vision & metrology: off-axis high-mag camera (auto/assisted alignment to fiducials); non-contact height sensor for auto-focus & levelling
Safety enclosure: Class 1 during normal operation (interlocked), with maintenance/override modes for service by qualified personnel
Software & workflow
Process Optimisation (parameter grid)
Program a 2D grid of patterns with X/Y variable parameters (e.g., power, PRF, speed, hatch/overlap), auto-mark, then inspect → select best window. Save/load configs to reuse.
Recipe Editor & Tiling
Build multi-tier recipes (plate → array → device → layers), assign DXFs and mark parameters, tile large DXFs into scan-field-sized “chunks,” and position precisely for big areas.
Scanner Calibration
Mark calibration grids, auto-measure, generate & apply correction files for field linearity and scale; verify with re-runs for traceable accuracy.
Camera↔Beam Calibration
Re-establish camera/beam offset after optics/camera changes to keep fiducial alignment tight.
Height Mapping
Create a height map CSV from the optical sensor to maintain focus over warped/stacked builds.
Inspection Utility
Full-window vision inspection, basic measurement & position save; export imagery for reports/QA.
Spec highlights
| Lasers (2 independent) | IR: 1064 nm, up to 20 W, 3–500 ns, ≤1 MHz PRF | DUV channel | 266 nm, up to 4 W, ≤33 ns, ≤100 kHz PRF |
|---|---|---|---|
| Beam delivery | Adjustable beam expanders, CNC aperture, galvo scanners, f-theta lenses | Advanced optics | DOE insertable; DUV CNC switch mirror → high-NA focusing lens |
| XY travel / speed | 500 mm × 300 mm, up to 200 mm/s | XY accuracy / repeatability | ±5 µm accuracy, ±0.5 µm repeatability; 100 nm resolution |
| Z travel | 100 mm | Z accuracy / repeatability | ±8 µm accuracy, ±1 µm repeatability; 0.5 µm resolution |
| Workholding | 6″×6″ levellable porous vacuum chuck | Metrology aids | Off-axis high-mag camera; non-contact optical height sensor |
| Machine structure | Granite slab + granite bridge on vibration isolators | Safety / modes | Safety PLC, interlocks; Production & Maintenance modes |
| Footprint / mass | ≈1700 (L) × 1100 (W) × 1800 (H) mm; ~1700 kg | Noise (processing) | ~72 dB at operator position |
| Utilities (power) | 380/415 VAC 3-phase + E; 50/60 Hz; peak 32 A; IEC 309 5-pin 32 A | Utilities (air) | 0.6 MPa, ~20 SLPM (max), oil-free dry air; 8/12 mm push-fit |
| Debris handling | External extract unit (HEPA/chem filter), vacuum pump | Laser thermal mgmt | AO (DUV) controller & chiller in 19″ rack |
| Process Optimisation | Grid-based parameter sweeps (X/Y variables), save/load configs | Recipe Editor | Tiered plate→device→layer tree; DXF-driven layers; preview |
| Scanner Calibration | Mark-capture grid, tolerance & interpolation; correction file apply | Camera↔Beam Offset | Guided mark/centre/save workflow to maintain alignment |
| Height Mapping | Camera-based grid collection → CSV height map; thickness assist | Inspection Utility | Large live view, motion control, pattern training, save positions |
| DXF Creator | On-tool simple DXF drawing & export | Vision & Alignment | Fiducials, alignment routines per node; stitched execution |
Parameter DOE: Polyimide Micro-Aperture Cutting
Objective: identify a process window that yields crisp edges, minimal HAZ, and ±(target) µm dimensional accuracy. DOE varied power, PRF, scan speed, and overlap on a fixed toolpath.
| Pattern ID | Power (%) | PRF (kHz) | Speed (mm/s) | Overlap (%) | Passes | Result notes |
|---|---|---|---|---|---|---|
| A1 | Edge, taper, HAZ, dim. error | |||||
| A2 | ||||||
| B1 | ||||||
| B2 | ||||||
| C1 | ||||||
| C2 |
- Power: [xx] % · PRF: [xx] kHz · Speed: [x.xx] mm/s · Overlap: [xx] % · Passes: [x]
- Edge quality: [text]; HAZ: [text]; Dimensional error: ±[x] µm
- Rationale: [why this window—balance of edge/throughput/dimensions]
Have a tricky material or geometry?
Let’s run a parameter DOE and show you the data.